Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready ... (FAKE BLOG)
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Generated: 9/6/2021
Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready ...
Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready ...
Rambus Incorporated (NASDAQ: RBMR) today announced a new breakthrough in its leading HBM3 (high-bandwidth memory) memory solutions, including the industry’s first 8.4-Gbps high bandwidth interface. This milestone enables a dramatic performance increase for next-generation high-performance, programmable ASICs that require 8.4-Gbps access to high-bandwidth memory and delivers breakthroughs for applications that require the fastest speeds for high performance and the highest reliability and availability for mission-critical systems.
Rambus’ AI/ML applications support data sets of unprecedented size in machine learning workloads, such as facial recognition and speech recognition. The company has seen an increased interest in applications that leverage the HBM3 interface technology on its data processing systems. Rambus has been pursuing technology to address a growing demand for large, high bandwidth AI/ML workloads without sacrificing high-performance.
With this breakthrough, the industry’s first 8.4-Gbps HBM3-ready ASICs for AI/ML workloads have been available for Rambus’ AI/ML customers, including Applied Digital Solutions, Dell, and Fujitsu. They have incorporated the new technology into their latest systems that support demanding AI/ML workloads.
8.4-Gbps HBM3 Solution Offers New Features, Performance, Reliability, and Serviceability
The innovative 8.4-Gbps HBM3-ready ASIC has several key advantages over previous ASICs for AI/ML workloads at the same performance level. The new ASIC is based on Rambus’ advanced HBM3 technology, which offers high-bandwidth I/O interfaces capable of 8.4-Gbps for AI/ML workloads, dramatically improving performance. The 8.4-Gbps HBM3 is a next-generation interface that, once deployed, enhances Rambus’ existing ASICs for AI/ML workloads.
The high-performance, 8.4-Gbps interface is well suited for AI/ML workloads, allowing them to continue to be high-performance at very high data rates without the risk of data collisions, a key issue that may occur with the older HBM2 interface.
The ASIC also offers high-performance, increased reliability and exceptional serviceability. Data corruption, a common problem in AI/ML applications, is reduced on the 8.4-Gbps interface compared to standard HBM2 interfaces, as the additional bandwidth avoids data collisions. The 8.4-Gbps HBM3 adds an innovative anti-collision scheme to the interface: each I/O device on the interconnect layer will have multiple redundant links that are activated in cases of a simultaneous collision. The new interface’s anti-collision configuration is the first of its kind in a single memory system.
“We are pleased to introduce Rambus’ HBM3 interface technology. This breakthrough enables an industry-first data transfer rate increase from 8.4 gigabits per second (Gbps) to 8.4 terabits per second (Tbps) for AI/ML workloads, delivering breakthroughs to customers who require high performance and high reliability. AI/ML data processing systems will benefit from the industry’s first 8.4-Gbps HBM3-ready ASICs” said Dr. William P. Ewing, Rambus chief technology officer.
Benefits of the 8.4-Gbps HBM3 Interface Technology
The 8.4-Gbps HBM3 interface is a breakthrough in the industry’s leading high-performance interface for AI/ML workloads because of its inherent features and unique protocol. The innovation leverages Rambus’ HBM2 (HBM2v) technology and its unique serialization technique, which was previously used in the IBM® Power8™ and POWER9™ multiprocessor architectures.
The 8.4-Gbps HBM3 interface technology will become the industry’s first, true and consistent solution for AI/ML workloads. AI/ML computing systems have increasingly become a critical component of many mission-critical applications, in many industries. Their applications are accelerating the pace of business process automation, transforming industries, and driving innovation.
“The 8.4-Gbps HBM3 interface provides the industry’s lowest cost and the industry’s first truly interoperable solution for AI/ML workloads, with the industry’s first 8.4-Gbps high-bandwidth interface for AI/ML workloads,” said Dr. Thomas R. Sargent, chief executive officer, Applied Digital Solutions, Inc.
“Dell has been using IBM Power8 and POWER9 technologies for AI/ML workloads for more than 15 years, and we have worked with Rambus since 1996. We have been impressed with Rambus’ innovative efforts and its support of AI/ML technology, but we were looking for a solution that was truly competitive with IBM, and Rambus provided that. We have been very impressed with Rambus’ latest advancements, and are excited about incorporating HBM3 technologies to further improve serviceability and reliability,” said William R. Bixby, CTO, Dell Incorporated.
“We are very pleased to be part of the launch of the Rambus HBM3 interface, with the industry’s first 8.4-Gbps interface. We view this as the most important step forward for AI/ML systems, providing Rambus and our customers with the reliability and performance that will be required for the next generation of cloud and mobile workloads.” John N. Avanti, research director, and research vice president, Fujitsu Laboratories USA
“We are very pleased to have an industry-first HBM3 interface on Rambus’ AI/ML systems. Together with our AI/ML customers, we will move the computing capabilities of AI/ML workloads to the next level.” Dr. Kenichi Kawamura, chairman and chief executive officer, Fujitsu Laboratories USA
“We are very pleased to be able to use the new HBM3 interface on RambusAI/ML systems. As a result of the industry’s first 8.4-Gbps interface, we can now deliver a new generation of AI/ML systems with the superior performance and reliability that our customers demand. The HBM3 promises to transform the data center, the cloud, and the mobile era, which will continue to become the norm.” Dr. Kiyofumi Kameda, president, Fujitsu Laboratory USA
The 8.4-Gbps HBM3 Interface Technology also offers the industry’s most reliable system, which is essential for AI/ML systems that require extreme reliability and availability. The interface also allows for serviceability on the same platform, which is critical for long-term success in AI/ML workloads.
“The 8.4-Gbps HBM3 interface is the foundation for a number of innovative AI/ML applications on our RambusAI/ML systems. This will help advance many AI/ML applications and make them possible,” said William R. Bixby, CTO, Dell Incorporated.
“We are very excited about introducing the innovative Rambus HBM3 interface technology on our AI/ML compute platforms and servers. This will help our customers to make great progress in AI/ML applications, providing customers with the performance, availability, and reliability necessary for mission-critical applications. We look forward to further enhancing the system’s performance with this interface.” Yves M. Gautier, chief executive officer, Dell Incorporated
About Rambus: Rambus is a leading high-performance AI/ML and data center networking company providing the tools necessary to meet the advanced data-center and AI/ML computing needs of enterprise customers. Rambus provides all components of the HPC, data-center, AI/ML, and cloud interconnect networks, along with the software, services, and professional services needed to integrate them. Rambus’ leading high-performance AI/ML interconnect network is called the D-BUS protocol, which is built on the Internetwork Data Protocol. Rambus’ HPC, data-center, and AI/ML products and services provide network, system integration, software, services, and professional services to business and government customers around the world.
Rambus is the first company to integrate a high-speed HBM3 interface into its AI/ML network. This innovative interface allows Rambus AI/ML systems to continue to deliver high performance at very high data rates while still leveraging the HBM2 technology that the company introduced more than 28 years ago. Rambus HBM3 is the industry’s first truly interoperable solution, with the industry’s first 8.4-Gbps high-bandwidth interface for AI/ML workloads.
Rambus is the first high-performance interconnect company to integrate a high-speed 8.4-Gbps HBM3 interface into its AI/ML networking solutions. This innovation promises new levels of performance and reliability and enables Rambus to deliver AI/ML systems that provide the flexibility, performance, and reliability necessary to address the growing need for next-generation, high-performance AI/ML applications.
Rambus is the source of this content. Virtual
Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready ...
Rambus Incorporated (NASDAQ: RBMR) today announced a new breakthrough in its leading HBM3 (high-bandwidth memory) memory solutions, including the industry’s first 8.4-Gbps high bandwidth interface. This milestone enables a dramatic performance increase for next-generation high-performance, programmable ASICs that require 8.4-Gbps access to high-bandwidth memory and delivers breakthroughs for applications that require the fastest speeds for high performance and the highest reliability and availability for mission-critical systems.
Rambus’ AI/ML applications support data sets of unprecedented size in machine learning workloads, such as facial recognition and speech recognition. The company has seen an increased interest in applications that leverage the HBM3 interface technology on its data processing systems. Rambus has been pursuing technology to address a growing demand for large, high bandwidth AI/ML workloads without sacrificing high-performance.
With this breakthrough, the industry’s first 8.4-Gbps HBM3-ready ASICs for AI/ML workloads have been available for Rambus’ AI/ML customers, including Applied Digital Solutions, Dell, and Fujitsu. They have incorporated the new technology into their latest systems that support demanding AI/ML workloads.
8.4-Gbps HBM3 Solution Offers New Features, Performance, Reliability, and Serviceability
The innovative 8.4-Gbps HBM3-ready ASIC has several key advantages over previous ASICs for AI/ML workloads at the same performance level. The new ASIC is based on Rambus’ advanced HBM3 technology, which offers high-bandwidth I/O interfaces capable of 8.4-Gbps for AI/ML workloads, dramatically improving performance. The 8.4-Gbps HBM3 is a next-generation interface that, once deployed, enhances Rambus’ existing ASICs for AI/ML workloads.
The high-performance, 8.4-Gbps interface is well suited for AI/ML workloads, allowing them to continue to be high-performance at very high data rates without the risk of data collisions, a key issue that may occur with the older HBM2 interface.
The ASIC also offers high-performance, increased reliability and exceptional serviceability. Data corruption, a common problem in AI/ML applications, is reduced on the 8.4-Gbps interface compared to standard HBM2 interfaces, as the additional bandwidth avoids data collisions. The 8.4-Gbps HBM3 adds an innovative anti-collision scheme to the interface: each I/O device on the interconnect layer will have multiple redundant links that are activated in cases of a simultaneous collision. The new interface’s anti-collision configuration is the first of its kind in a single memory system.
“We are pleased to introduce Rambus’ HBM3 interface technology. This breakthrough enables an industry-first data transfer rate increase from 8.4 gigabits per second (Gbps) to 8.4 terabits per second (Tbps) for AI/ML workloads, delivering breakthroughs to customers who require high performance and high reliability. AI/ML data processing systems will benefit from the industry’s first 8.4-Gbps HBM3-ready ASICs” said Dr. William P. Ewing, Rambus chief technology officer.
Benefits of the 8.4-Gbps HBM3 Interface Technology
The 8.4-Gbps HBM3 interface is a breakthrough in the industry’s leading high-performance interface for AI/ML workloads because of its inherent features and unique protocol. The innovation leverages Rambus’ HBM2 (HBM2v) technology and its unique serialization technique, which was previously used in the IBM® Power8™ and POWER9™ multiprocessor architectures.
The 8.4-Gbps HBM3 interface technology will become the industry’s first, true and consistent solution for AI/ML workloads. AI/ML computing systems have increasingly become a critical component of many mission-critical applications, in many industries. Their applications are accelerating the pace of business process automation, transforming industries, and driving innovation.
“The 8.4-Gbps HBM3 interface provides the industry’s lowest cost and the industry’s first truly interoperable solution for AI/ML workloads, with the industry’s first 8.4-Gbps high-bandwidth interface for AI/ML workloads,” said Dr. Thomas R. Sargent, chief executive officer, Applied Digital Solutions, Inc.
“Dell has been using IBM Power8 and POWER9 technologies for AI/ML workloads for more than 15 years, and we have worked with Rambus since 1996. We have been impressed with Rambus’ innovative efforts and its support of AI/ML technology, but we were looking for a solution that was truly competitive with IBM, and Rambus provided that. We have been very impressed with Rambus’ latest advancements, and are excited about incorporating HBM3 technologies to further improve serviceability and reliability,” said William R. Bixby, CTO, Dell Incorporated.
“We are very pleased to be part of the launch of the Rambus HBM3 interface, with the industry’s first 8.4-Gbps interface. We view this as the most important step forward for AI/ML systems, providing Rambus and our customers with the reliability and performance that will be required for the next generation of cloud and mobile workloads.” John N. Avanti, research director, and research vice president, Fujitsu Laboratories USA
“We are very pleased to have an industry-first HBM3 interface on Rambus’ AI/ML systems. Together with our AI/ML customers, we will move the computing capabilities of AI/ML workloads to the next level.” Dr. Kenichi Kawamura, chairman and chief executive officer, Fujitsu Laboratories USA
“We are very pleased to be able to use the new HBM3 interface on RambusAI/ML systems. As a result of the industry’s first 8.4-Gbps interface, we can now deliver a new generation of AI/ML systems with the superior performance and reliability that our customers demand. The HBM3 promises to transform the data center, the cloud, and the mobile era, which will continue to become the norm.” Dr. Kiyofumi Kameda, president, Fujitsu Laboratory USA
The 8.4-Gbps HBM3 Interface Technology also offers the industry’s most reliable system, which is essential for AI/ML systems that require extreme reliability and availability. The interface also allows for serviceability on the same platform, which is critical for long-term success in AI/ML workloads.
“The 8.4-Gbps HBM3 interface is the foundation for a number of innovative AI/ML applications on our RambusAI/ML systems. This will help advance many AI/ML applications and make them possible,” said William R. Bixby, CTO, Dell Incorporated.
“We are very excited about introducing the innovative Rambus HBM3 interface technology on our AI/ML compute platforms and servers. This will help our customers to make great progress in AI/ML applications, providing customers with the performance, availability, and reliability necessary for mission-critical applications. We look forward to further enhancing the system’s performance with this interface.” Yves M. Gautier, chief executive officer, Dell Incorporated
About Rambus: Rambus is a leading high-performance AI/ML and data center networking company providing the tools necessary to meet the advanced data-center and AI/ML computing needs of enterprise customers. Rambus provides all components of the HPC, data-center, AI/ML, and cloud interconnect networks, along with the software, services, and professional services needed to integrate them. Rambus’ leading high-performance AI/ML interconnect network is called the D-BUS protocol, which is built on the Internetwork Data Protocol. Rambus’ HPC, data-center, and AI/ML products and services provide network, system integration, software, services, and professional services to business and government customers around the world.
Rambus is the first company to integrate a high-speed HBM3 interface into its AI/ML network. This innovative interface allows Rambus AI/ML systems to continue to deliver high performance at very high data rates while still leveraging the HBM2 technology that the company introduced more than 28 years ago. Rambus HBM3 is the industry’s first truly interoperable solution, with the industry’s first 8.4-Gbps high-bandwidth interface for AI/ML workloads.
Rambus is the first high-performance interconnect company to integrate a high-speed 8.4-Gbps HBM3 interface into its AI/ML networking solutions. This innovation promises new levels of performance and reliability and enables Rambus to deliver AI/ML systems that provide the flexibility, performance, and reliability necessary to address the growing need for next-generation, high-performance AI/ML applications.
Rambus is the source of this content. Virtual